Mass Production (Taiwan)
Mass Production (China)
Layers
Current Highest : 22 layers
Capability : Up to 26 Layers
Current Highest :14 Layers
Capability : Up to 20 layers
Drill Bit
10 mil
10 mil
Micro-Via
6 mil
6 mil
Inner Layer Line Width/Space
3.5/3.5 (mil)
3.5/3.5 (mil)
Outer Layer Line Width/Space
3.5/3.5 (mil)
3.5/3.5 (mil)
Impedance
+/- 10%
+/- 10%
Surface Finish
HASL, Entek, Silver, ENIG, Hard Gold
HASL, Entek, Silver,
Im. Tin, ENIG
LF HASL (study)
Cu Thickness
Hoz, 1oz, 2oz
Hoz, 1oz, 2oz, 3oz
FHS
8 mil
8 mil
Panel Size
18”X24”
21”X26”
HDI Type
2+N+2;1+N+1; VIP
1+N+1
Board Thickness
<150mil
<128mil

 

Material
FR4(TG140), FR4(Tg170), FR406, Getek, FR408, Halogen Free, RCC
FR4-TG140, FR4-Tg170 Halogen Free