|
|
 |
|
| |
|
| |
|
Feature
|
Production
|
Sample
Run
|
Advanced
|
|
|
|
2002
|
2002
|
2003
|
2004
|
|
Material
|
|
|
|
|
|
FR4 1300° Tg
|
Yes
|
Yes
|
Yes
|
Yes
|
|
GETEK
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Isola 406 (FR406)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
FR5 180° Tg
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Nelco N4000-13
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Halogen Free Material
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Isola 408 (FR408)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
FR4 170° Tg
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Roger 4003/4350
|
Yes
|
Yes
|
Yes
|
Yes
|
|
FR4 150° Tg
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Nelco N6000
|
Yes
|
Yes
|
Yes
|
Yes
|
|
NPLD (Nan Ya Low Dk)
|
-
|
Yes
|
Yes
|
Yes
|
|
Process Capability
|
|
|
|
|
|
I/L Trace and Space (1
oz)
|
4
|
3.5
|
2.5
|
2
|
|
I/L Trace and Space (0.5
oz)
|
3.5
|
3.25
|
2.5
|
2
|
|
O/L Trace and Space
|
4
|
3
|
2.5
|
2
|
|
Drill Through Hole
|
10
|
8
|
8
|
6
|
|
Pad over drill size
|
12
|
10
|
8
|
6
|
|
Antipad Over drill size
|
20
|
19
|
18
|
16
|
|
Maximum aspect ratio
|
8
|
10
|
12
|
14
|
|
Layer Counts
|
18
|
24+
|
28+
|
30+
|
|
Core Thickness
|
4
|
3
|
2
|
2
|
|
Differential impedance
control
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Impedance control
|
+/-10%
|
+/-8%
|
+/-8%
|
+/-5%
|
|
Board thickness,
(Minimum ~Maximum)
|
24~210
|
24~250
|
24~300
|
24~350
|
|
Surface Finishes
|
OSP , HASL , Electroless
Nickel/Au , Gold fingers Electrolytic Nickel/Au ,
Immersion Silver, Immersion Tin .
|
|
Special Capability
|
Unit :
mil
|
|
Feature
|
Production
|
Sample
Run
|
Advanced
|
|
|
|
2002
|
2002
|
2003
|
2004
|
|
Rambus (Impedance control
28+/-10%)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Buried Capacitance
|
-
|
Yes
|
Yes
|
Yes
|
|
Buried Resistor
|
-
|
Yes
|
Yes
|
Yes
|
|
Pin Lamination
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Perfect Test gauge system
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Advanced HDI Product
Capability
|
Unit :
mil
|
|
Feature
|
Production
|
Sample
Run
|
Advanced
|
|
|
|
2002
|
2002
|
2003
|
2004
|
|
Material (insulation
layer)
|
|
RCC
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Thermal Ink
(130℃ Tg and 170℃ Tg)
|
-
|
-
|
Yes
|
Yes
|
|
FR4/FR5 prepreg
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Film type insulation
material(170℃ Tg)
|
-
|
-
|
Yes
|
Yes
|
|
Process Capability
(mil)
|
2002
|
2002
|
2003
|
2004
|
|
I/L Trace and Space(1
oz)
|
3.5
|
3
|
2.5
|
2
|
|
I/L Trace and Space(0.5
oz)
|
3
|
2.75
|
2
|
2
|
|
O/L Trace and Space
|
3.5
|
3
|
2.5
|
2
|
|
Drill through hole
|
10
|
8
|
8
|
8
|
|
Pad over drill size
|
12
|
10
|
9
|
8
|
|
Buried Via hole size
|
10
|
8
|
8
|
8
|
|
Blind Via hole size
|
5
|
4
|
3
|
3
|
|
AntiPad Over Blind via
size
|
10
|
8
|
6
|
6
|
|
Pad over Blind Via size
|
10
|
8
|
6
|
4
|
|
Laser Via(CO2)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Build up layers per side
|
2
|
2
|
2
|
3
|
|
Maximum aspect ratio
of microvia
|
0.8
|
1
|
1
|
1.0
|
|
Filled Via Process (Min.
hole size)
|
10
|
8
|
8
|
8
|
|
Multidepth Blind via
|
-
|
-
|
Yes
|
Yes
|
|
Stack via(1-2,2-3 blind
via)
|
-
|
Yes
|
Yes
|
Yes
|
|
Skip via(1-3 layer blind
via,skip2)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Sequential Lamination
(Symmetric)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Sequential Lamination
(Non Symmetric)
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Package Substrate PBGA
, CSP , Flip chip
|
Unit : μ
m
|
|
Feature
|
Production
|
Sample
Run
|
Advanced
|
|
|
|
2002
|
2002
|
2003
|
2004
|
|
Material
|
|
|
|
|
|
BT
|
Yes
|
Yes
|
Yes
|
Yes
|
|
E679
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Advanced Material (A-PPE)
|
-
|
-
|
Yes
|
Yes
|
|
Process capability(unit:μm)
|
|
|
|
|
|
I/L Trace and Space(1
oz)
|
90
|
70
|
70
|
50
|
|
I/L Trace and Space(0.5
oz)
|
75
|
50
|
50
|
50
|
|
O/L Trace and Space
|
30
|
25
|
20
|
20
|
|
SAP Process capability
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Drill Through Hole
|
200
|
150
|
150
|
150
|
|
Pad over drill size
|
75
|
50
|
50
|
40
|
|
Laser Via(CO2 &
UV YAG)
|
50
|
50
|
50
|
50
|
|
Build up layers per side
|
2
|
2
|
3
|
4
|
|
Stack via
|
-
|
Yes
|
Yes
|
Yes
|
|
Skip via
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Via on PTH
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Filled Via capability
|
Yes
|
Yes
|
Yes
|
Yes
|
|
S/M on pad registration
|
24
|
20
|
20
|
15
|
|
Etching Back Process
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Surface Finishes
|
Electroless Nickel/Au
, Electrolytic bondable Nickel/Au/Direct Immersion Au/Pre-Solder
|
|
Reliability Testing
|
TCT, PCT, HAST, TST,
JEDEC Standard precondition, Wire bond test, Ball shear test.
|
|
Solder Bump capability
:
|
|
|
|
|
|
Bump Material
|
Eutectic
Solder
|
Lead free
Solder
|
both
|
both
|
|
Bump height
(μm)
|
+25/-10
|
+35/-10
|
+35/-10
|
+35/-10
|
|
Bump Diameter (μm)
|
100
± 60
|
100
± 50
|
100
± 50
|
100
± 50
|
|
Co-planarity (μm)
|
< 15
|
< 15
|
< 10
|
< 10
|
Reliability
Lamination
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
Glass Transition
Temperature
|
D.S.C
T.M.A
D.M.A
|
FR- 4 Tetra>130°C
(D.S.C)
FR- 5 >175°C (D.M.A)
FR- 406>165°C (D.S.C)
BT>210°C (D.M.A)
Getek>170°C (D.M.A)
|
>132°C
>178°C
>168°C
>212°C
>172°C
|
|
Peel strength
|
IPC-TM-650
|
Trace to Laminate>9
lb/in
Layer to Layer>4 lb/in
|
>10 lb
>6 lb
|
Hole Wall Quality
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
Temperature
Cycling
|
125°C,30Min
Room Temp
-55°C,30Min
Room Temp 10Min
|
1.Hole Wall Resistance<20%
change after 1000 cycles
2.Hole Wall Quality
|
1.<20%
2.No Crack
|
|
Thermal
Shock
|
125°C,5min
-55°C,5min
|
1.Hole Wall Resistance<10%
change after 100 cycle
2.Hole wall Quality
|
1.<10%
2.No Crack
|
|
Thermal stress
|
288°C,10sec,
Solder Float
|
No Delamination
No Hole wall Detect
|
Pass
|
Copper Plating
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
Elongation Test
|
TPC-TM-650
|
>6%
|
>10%
|
|
Tensile Strength
|
TPC-TM-650
|
>25kg/mm
|
>30kg
|
Solderability
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
PTH
SMD / BGA Pad
|
1.Solder Pot Floating:
245°C,4sec
2.Wetting Balance
|
no deweting
|
Pass
|
Cleanliness
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
Surface
Insulation
Resistance
|
Pre Condition:23°C,
50% RH,3hr
Test Condition:35°C,
85% RH,24hr
|
Insulation Resistance
After Black Oxide>10 M ohm
After O/L Etch>10 M ohm
After HASL>3 M ohm
|
>10 M ohm
>10 M ohm
>4 M ohm
|
|
Solvent
Extract
Conductivity
|
Omega Meter 600
SMD 15min
Omega Meter 500
SMD 15min (for BGA)
After Black Oxide,
O/L Etch, Finish Board
|
1. < 6.4mgNacl/in2
2. < 2.4mgNacl/in2
(for BGA substrate)
|
1. Avg:<4
2. Avg:<2.0
|
|
High Humidity
|
50°C,95%/RH,
7days,100V Bias
|
Resistance>1 M ohm
|
Pass
|
|
I.C.T
|
I.C.T
|
1. Cl- <3mg/in2
2. Br- <3mg/in2
3. SO42- <10mg/in2
|
1. Avg:<2.8
2. Avg:<2
3. Avg:<8
|
Electrical
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
High Pot. Test
|
1000 Volts,1minute
|
<1mA Leakage
|
Pass
|
Environment
|
Test
Item
|
Test
Method/
Equipment
|
Criteria
|
Capability
|
|
Water absorption
Test (for BGA)
|
120°C,2hrs,after 24hrs
|
Wight increase <0.24%
after 24hrs test
|
<0.2%
|
|
| |
|
|
 |
