1985

• Start up Plant I (PCB) HVM

1992

• Start up Plant II (PCB) HVM

1993

• ISO 9002 Certification

1996

• ISO 14001 Certification

1998

• Start up Plant III (HVM) PCB

1999

• QS 9000 Certification

2000

• Start up Plant IV (W/B Substrate) HVM

2001

• Start up Plant V (FC Substrate - FE) HVM

• OHSAS-18001 Certification
• TL 9000 Certification

2002

• Start up Plant 1 (FC Substrate - BE) HVM
• Kunshan (China) Plant I Mass Production HVM (PCB)

• ISO 9002 Version 2000

2003

• Break Ground for Kunshan (China) Plant II

• Certificate from Green Partner from Sony
• Green Product Certification from Sony

2004

• Modify Plant II into Wire Bond Manufacturing

• TS-16949 Certification

2005

• Modify Plant III partially into FC Process and Manufacturing

2006

• Became public listed company in Taiwan
• Ground breaking for Shu Lin FC plant

2007

• Kunshan (China) Plant II Mass Production (W/B Substrate)