Year
Event List
Certification
1985
• Start up Plant I (PCB) HVM
1992
• Start up Plant II (PCB) HVM
1993
• ISO 9002 Certification
1996
• ISO 14001 Certification
1998
• Start up Plant III (HVM) PCB
1999
• QS 9000 Certification
2000
• Start up Plant IV (W/B Substrate) HVM
2001
• Start up Plant V (FC Substrate - FE) HVM
• OHSAS-18001 Certification
• TL 9000 Certification
2002
• Start up Plant 1 (FC Substrate - BE) HVM
• Kunshan (China) Plant I Mass Production HVM (PCB)
• ISO 9002 Version 2000
2003
• Break Ground for Kunshan (China) Plant II
• Certificate from Green Partner from Sony
• Green Product Certification from Sony
2004
• Modify Plant II into Wire Bond Manufacturing
• TS-16949 Certification
2005
• Modify Plant III partially into FC Process and Manufacturing
2006
• Became public listed company in Taiwan
• Ground breaking for Shu Lin FC plant
2007
• Kunshan (China) Plant II Mass Production (W/B Substrate)